Feature	Copper Base PCB (MCPCB)	Normal FR4 PCB
Core Material	Solid Copper plate/core.	FR4 (Fiberglass woven cloth and epoxy resin).
Primary Advantage	Thermal Management (Heat Dissipation).	Cost-Effectiveness and Design Flexibility.
Thermal Conductivity $mathbf{W/mcdot K}$	Excellent: Up to 400 W/m·K (Pure Copper).	Poor: Typically 0.3 to 0.4 W/m·K (Epoxy Resin).
Current Handling	Very High. The thick copper base can also be used as a ground/power plane or heat sink.	Limited. Relies on the copper trace thickness (typically 1-2 oz).
Mechanical Strength	High Rigidity. The metal core provides excellent durability and resistance to warping/vibration.	Moderate. Sufficient for most consumer electronics but less robust.
Coefficient of Thermal Expansion (CTE)	Lower and Better Matched to the copper circuit layers.	Higher (especially in the Z-axis), leading to thermal stress and potential PTH/via failure during temperature cycling.
Design Flexibility	Limited Layer Count (mostly single or double-sided) due to the solid metal core.	Excellent. Supports complex, multi-layer designs (4, 6, 8+ layers) for high-density routing.
Cost	Higher. Copper is an expensive material, and processing is more specialized.	Low. Cost-effective and widely available for mass production.
Typical Applications	High-power LEDs, motor controllers, power supplies, automotive electronics, and high-frequency communication modules.	Consumer electronics (smartphones, computers), low-to-mid power devices, and complex digital circuits.

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