GT SMART (Changsha) Technology Co., Limited
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The HDI PCB (High Density Interconnect Printed Circuit Board) is a cutting-edge technology that offers exceptional performance and reliability for a wide range of electronics applications. With a maximum substrate size of 24”x32”, this PCB is designed to meet the demands of complex and high-density circuit designs.
One of the key features of the HDI PCB is its laser-drilled construction, which allows for precise and intricate circuit patterns to be created with unmatched accuracy. This advanced manufacturing process enables the creation of densely packed components and microvias, resulting in a more compact and efficient circuit board.
When it comes to specifications, the HDI PCB boasts impressive capabilities. The minimum solder mask bridge of 0.08mm ensures tight spacing between solder mask openings, enhancing the overall reliability of the board. Additionally, the minimum line space of 0.075mm allows for fine traces to be routed with precision, supporting high-speed signal transmission.
For the base material, the HDI PCB can be manufactured using various options including FR4, ROGERS, Aluminum, High TG and middle TG. This flexibility in base material selection allows for customization based on specific application requirements, ensuring optimal performance in diverse operating environments.
With a copper thickness of 1oz, the HDI PCB offers excellent conductivity and thermal performance, making it suitable for applications where reliable signal integrity and heat dissipation are critical. The copper layer provides a solid foundation for component attachment and ensures consistent electrical performance across the board.
In summary, the HDI PCB is a state-of-the-art solution for demanding electronic designs that require precision, reliability, and high performance. Its laser-drilled construction, high-density interconnect capabilities, and fine line spacing make it an ideal choice for applications where space constraints and signal integrity are paramount.
The HDI PCB (High Density Interconnect Printed Circuit Board) is a versatile product that finds application in a wide range of scenarios due to its advanced features and capabilities. Manufactured in China, this product boasts a high level of quality and reliability, making it suitable for various industries and applications.
One of the key attributes of the HDI PCB is its base material options, including FR4, ROGERS, Aluminum, High TG. This diverse selection allows for customization based on specific project requirements, ensuring optimal performance in different environments.
With a minimum line space of 0.075mm and a copper thickness of 1OZ, the HDI PCB offers excellent conductivity and signal integrity, making it ideal for applications that demand high precision and efficiency. The ±10% impedance control further enhances the product's reliability, ensuring consistent performance across different circuit layouts.
Additionally, the green solder mask provides protection and insulation for the PCB, safeguarding it against environmental factors and ensuring long-term durability.
The multilayer interconnect design of the HDI PCB makes it suitable for complex electronic systems that require high-density routing and compact layouts. Its high performance capabilities make it ideal for use in advanced electronics such as smartphones, tablets, medical devices, and aerospace equipment.
Whether in telecommunications, consumer electronics, automotive, or industrial applications, the HDI PCB excels in providing reliable interconnect solutions for modern electronic devices. Its versatility, reliability, and high performance make it a preferred choice for manufacturers looking to push the boundaries of technology.