GT SMART (Changsha) Technology Co., Limited
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Layer 4L FR4+Isola High Frequency PCB _1.6mm_ENIG 1oz Plating gold 30u”
HFPs are composed of complex material layers that are optimized for high-frequency performance. The material layers of an HFP must be carefully selected and combined to ensure optimal performance. Each layer is essential for the proper functioning of the PCB and its performance.
| Layers | 4L |
| Material | FR4+Isola |
| Board thickness | 1.6mm |
| Copper thickness | 1oz |
| Surface treatmnet | ENIG+Plating gold 30u” |